Fundraising Fox

Leila Daneshmandi

Founder

Co-founder & COO at Encapsulate

Greater Boston

FoundedEncapsulate

About

Leila Daneshmandi is Co-Founder and COO of Encapsulate, a seed-stage MedTech startup developing automated tumor-on-a-chip systems that measure patients' clinical response to chemotherapy to support personalized cancer treatment. She is an Assistant Professor in Innovation and Entrepreneurship and Founding Director of the Entrepreneurship Hub at the University of Connecticut's College of Engineering, and also serves as Co-Director of the Nursing and Engineering Innovation Center. She holds a Ph.D. in Biomedical Engineering and a Master's in Global Entrepreneurship from the University of Connecticut, and is a board member of the Connecticut Invention Convention.

Co-founder & COO at Encapsulate

Intro paths

In turn, Leila can intro founders to Encapsulate's investors below.

Co-founders at Encapsulate

ARArmin Rad
Armin RadCo-founder & CEO

Experience

  1. EncapsulateCo-Founder and COOcurrent2020 — presentFarmington, CT
  2. University of ConnecticutDirector of the Matthew & Margarethe Mashikian Innovation & Entrepreneurship Hub (eHub)current2023 — present
  3. University of ConnecticutFounding Co-Director at the Nursing and Engineering Innovation Centercurrent2023 — present
  4. University of ConnecticutAssistant Professor in Residence of Innovation and Entrepreneurshipcurrent2021 — present
  5. Connecticut Invention Convention (CIC)Board Membercurrent2022 — presentHartford, Connecticut, United States
  6. Connecticut Center for Entrepreneurship and Innovation (CCEI)NSF I-Corps Instructor2024
  7. Fletcher Spaght, Inc.Healthcare Strategy Analyst2021Boston, Massachusetts, United States
  8. Connecticut Center for Entrepreneurship and InnovationEntrepreneur In Residence2021
  9. University of ConnecticutInstructor2020Storrs, Connecticut, United States
  10. University of ConnecticutGraduate Teaching Assistant2020Storrs, Connecticut, United States
  11. UConn HealthGraduate Research Assistant2015 — 2020Hartford, Connecticut Area
  12. Temple UniversityGraduate Research Assistant2014 — 2015Greater Philadelphia Area
  13. Amirkabir University of Technology - Tehran PolytechnicTeaching Assistant2014Tehran, Iran
  14. Marlik Institute of Innovation and TechnologyInternship2013Rasht, Iran

Skills & more

Program ManagementBoard GovernanceResource DevelopmentTeachingStakeholder ManagementPartnership-buildingEcosystem ManagementProgram DevelopmentCoaching & MentoringResource ManagementFinancial ManagementReal-Time Polymerase Chain Reaction (qPCR)
+12 moreBiomaterialsTissue EngineeringBiomedical EngineeringCell CultureConfocal MicroscopyPCRScanning Electron MicroscopyELISAAnalytical SkillsTeamworkStrategic ThinkingDiversity & Inclusion

Languages English · Persian

From Leila's professional profile.

Frequently asked questions

Who is Leila Daneshmandi?
Leila Daneshmandi is Co-Founder and COO of Encapsulate, a seed-stage MedTech startup developing automated tumor-on-a-chip systems that measure patients' clinical response to chemotherapy to support personalized cancer treatment. She is an Assistant Professor in Innovation and Entrepreneurship and Founding Director of the Entrepreneurship Hub at the University of Connecticut's College of Engineering, and also serves as Co-Director of the Nursing and Engineering Innovation Center. She holds a Ph.D. in Biomedical Engineering and a Master's in Global Entrepreneurship from the University of Connecticut, and is a board member of the Connecticut Invention Convention.
Where does Leila Daneshmandi work?
Leila Daneshmandi is Co-founder & COO of Encapsulate.
What companies did Leila Daneshmandi found?
Leila Daneshmandi founded Encapsulate.
Where did Leila Daneshmandi go to school?
Leila Daneshmandi studied at University of Connecticut (Doctor of Philosophy (PhD), Bioengineering and Biomedical Engineering); University of Connecticut (Master's degree, Master of Engineering in Global Entrepreneurship); Temple University (Doctor of Philosophy (PhD), Bioengineering and Biomedical Engineering).

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