Eliyan

Eliyan Corp. is a Santa Clara, California-based semiconductor company that develops interconnect technology for chiplet-based systems used in generative AI and high-performance computing data centers. Its core product is the NuLink PHY, a protocol-agnostic physical-layer IP core optimized for high-speed serial die-to-die (D2D) links that supports the industry-standard Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) interfaces as well as a proprietary simultaneous bidirectional (SBD) mode. NuLink is offered in advanced-packaging (NuLink-AP) and standard-packaging (NuLink-SP) variants across bump pitches from 40 to 130 microns, and has been extended to chip-to-chip connections as NuLink-X. The company also offers NuGear chiplets for memory and I/O connections, and its portfolio spans die-to-die, chip-to-chip and rack-to-rack architectures for electrical and optical environments.

Eliyan positions NuLink as a way to relieve bandwidth, power and packaging constraints in AI subsystems: the company states the technology can deliver up to 4x the bandwidth and 2x the power efficiency of alternatives, increase the number of HBM stacks in a package by 4x, extend interconnect reach by 10x, and cut packaging, test and assembly costs by at least 2x by allowing standard organic substrates instead of silicon interposers — which it says can also shorten AI ASIC time to market by up to 26 weeks. NuLink's bidirectional transceivers underpin die-to-memory proposals including SPHBM (HBM-to-ASIC connectivity over standard packaging) and a Universal Memory Interface (UMI) concept in which one ASIC design connects to DDR, GDDR or HBM memory chiplets, or to non-memory dies such as co-packaged optics and SerDes chiplets.

More recently the company has moved into electro-optical interconnects, introducing NuLink-XD, a power-reach configurable 224G PAM4 SerDes aimed at low-power electro-optical modules for AI scale-up, and publishing work on HBM4 and SPHBM4 memory bandwidth scaling.