American Semiconductor
Boise, US · Idaho corporation
American Semiconductor develops and manufactures ultra-thin chip technology, including its Semiconductor-on-Polymer (SoP) wafer level chip scale packaging for thin-device applications such as chip-on-flex and multi-chip packaging. It provides design, assembly, test, and custom engineering services for the semiconductor industry from its facility in Boise, Idaho.
Founders & leadership
Reported raises · per SEC filings
Form D private placements$840.9K disclosed across 1 round · 2017
▶$840.9KraisedNov 2018 · 17 investors · ManufacturingRule 506(c)
- Tim L HaneyDirector
- Thomas P JensenDirector
- Kelly A FullerDirector
- Lorelli Dana HacklerExecutive Officer
- Douglas Ray HacklerExecutive Officer
- Offering amount
- $2M
- Amount sold
- $840.9K
- Minimum investment
- $10K
- First sale
- Feb 2017
- Incorporated
- Corporation, Idaho
- Federal exemptions
- 06c
Source: SEC EDGAR Form D. Amounts as filed; amended filings shown once at their latest values.
Competitors · 1
by search overlap
Companies competing with American Semiconductor for the same Google search keywords, organic and paid, via search-intersection analysis.
Non-dilutive funding · 21 SBIR/STTR awards
Federal grants — no equity taken| Agency | Phase | Year | Amount |
|---|---|---|---|
| U.S. ArmyArmy | Phase II | 2020 | $572.6K |
| U.S. ArmyArmy | Phase I | 2019 | $107.9K |
| U.S. Air ForceAir Force | Phase II | 2014 | $1.3M |
| Department of Energy | Phase I | 2013 | $150K |
| U.S. Air ForceAir Force | Phase I | 2012 | $150K |
| NASA | Phase I | 2012 | $124.9K |
| Department of Energy | Phase II | 2011 | $1000K |
| U.S. Air ForceAir Force | Phase II | 2011 | $749.4K |
| Missile Defense Agency | Phase I | 2011 | $100K |
| Department of Energy | Phase I | 2010 | $100K |
| U.S. Air ForceAir Force | Phase I | 2010 | $99.9K |
| Missile Defense Agency | Phase I | 2009 | $99.9K |
| Department of Energy | Phase I | 2008 | $100K |
| U.S. Air ForceAir Force | Phase II | 2006 | $750K |
| NASA | Phase II | 2006 | $599.9K |
| Department of Energy | Phase I | 2006 | $94.1K |
| U.S. Air ForceAir Force | Phase I | 2005 | $100K |
| NASA | Phase I | 2005 | $59.3K |
| U.S. Air ForceAir Force | Phase I | 2002 | $99.7K |
| Missile Defense Agency | Phase I | 2002 | $69.6K |
| Missile Defense Agency | Phase I | 2002 | $69.3K |
Source: SBIR.gov award data (U.S. Small Business Administration). SBIR/STTR awards are competitive federal R&D grants and contracts — non-dilutive capital alongside any venture rounds above.
Frequently asked questions
- What does American Semiconductor do?
- American Semiconductor develops and manufactures ultra-thin chip technology, including its Semiconductor-on-Polymer (SoP) wafer level chip scale packaging for thin-device applications such as chip-on-flex and multi-chip packaging. It provides design, assembly, test, and custom engineering services for the semiconductor industry from its facility in Boise, Idaho.
- How much funding has American Semiconductor raised?
- American Semiconductor has disclosed $840.9K raised across 1 round.
- Where is American Semiconductor headquartered?
- American Semiconductor is headquartered in Boise, US.