Fundraising Fox

SemiAI

3 known investors

SemiAI builds AI systems designed for semiconductor manufacturing process data, including overlay/defect prediction, human-in-the-loop root cause analysis, and domain-fusion ML, to automate decision-making on fab production lines. It serves semiconductor manufacturers, combining AI engineers, process specialists, and system engineers to make fab operations more autonomous.

Also known as SMILE (Semiconductor Manufacturing Intelligence) Β· 세미에이아이

Founders & leadership

TJ
Taekwon JeeFounder & CEO

Investors Β· 3

Also in the syndicate Β· 2

ENSL PartnersleadNewborn Ventures

Company profile

researched Aug 2026

SemiAI is a South Korean semiconductor AI company that builds fab-native software for chip manufacturers. Its product line, SMILE (Semiconductor Manufacturing Intelligence), is positioned as an agentic AI platform that forecasts process drift, predicts yield issues, accelerates root-cause analysis and supports process-control decisions. The platform is offered in tiers: SMILE Lite for real-time detection and multimodal analysis of process data, SMILE Pro for predictive redesign of advanced process control (APC) beyond reactive control, and SMILE Pro+ for domain-specific modeling that compresses wafer position and defect data into a single vector for instant similar-case retrieval.

A central element of the technology is Virtual Fab, a synthetic data generation and digital-twin approach that simulates sensor, equipment and wafer data across manufacturing stages. Models are pre-trained on these synthetic patterns so they can be used without customer data at the outset, with synthetic and real fab data cross-validating one another. The company states its agents operate under human-in-the-loop supervision and act on recommendations rather than stopping at observation, and that its approach shortens yield analysis and improvement cycles from more than seven days to under ten minutes.

The company reports overlay prediction accuracy of 0.3 nm, RΒ² above 0.9 and a 3x RMSE improvement over XGBoost, and cites earlier core-model validation of 99% overlay defect prediction accuracy and 95% MVP RCA accuracy. It has published research accepted at SPIE Advanced Lithography 2025 and 2026 on proactive yield maximization in photolithography via human-in-the-loop AI, systematic optimization of overlay key positions, and domain knowledge-driven fusion machine learning for overlay prediction, and holds patents covering EPE budget component analysis and agent-based root-cause analysis in manufacturing in the US and Korea.

Founding story

SemiAI was founded in January 2025 by Taekwon Jee, who holds a Ph.D. in mechanical engineering from UC Berkeley and has more than 15 years of semiconductor industry experience at SK hynix, ASML, Samsung and Lam Research, including development of an Edge Placement Error improvement methodology for yield analysis and ML/AI-based yield improvement systems. He started the company with engineers who had worked on fab floors.

Business model

SemiAI licenses software to semiconductor manufacturers and fabs, entering customers through proof-of-concept engagements. It signed its first paid PoC contract with a semiconductor customer in early 2026 with two further PoCs running in parallel, and states an ambition to become an AI infrastructure company built on the data generated across semiconductor production.

Revenue is generated from paid proof-of-concept contracts with semiconductor customers, with the first such contract signed in March 2026.

Traction

SemiAI reports core model validation in April 2025 (99% overlay defect prediction, 95% MVP RCA), shipped SMILE Lite v1.0 and Pro v0.5 in December 2025 with operation in customer environments, and signed its first paid PoC in March 2026 with two more running in parallel. It has three papers accepted at SPIE Advanced Lithography 2026, a patent portfolio in process, metrology and RCA, and backing from ENSL Partners, Kakao Ventures, Newborn Ventures, Schmidt and the TIPS Deep Tech track.

Latest developments

In 2026 the company closed a Seed II round with Newborn Ventures, signed its first paid PoC, was named a Lam Capital Venture Competition Finalist 10, and raised a bridge round from Schmidt in July 2026 to expand US proof-of-concept work and hire locally. It presented three papers at SPIE Advanced Lithography 2026 and presented its agentic AI manufacturing technology at SEMICON Taiwan 2026.

β–ΈFull profile β€” market position, technology, go-to-market, geography, history

Market position

SemiAI positions itself as a domain-first alternative to off-the-shelf LLM/ML tooling, designing embeddings and traces around fab physics and workflows. Its investor and research network includes ENSL Partners, Kakao Ventures, Newborn Ventures and the TIPS Deep Tech program, and it was selected among ten finalists at the Lam Capital Venture Competition.

SemiAI states three differentiators: domain-first AI designed around real fab physics and workflow rather than generic LLM/ML models; agents that act under human-in-the-loop supervision rather than only observing and recommending; and validation in which Virtual Fab synthetic data and real fab data check each other so systems are production-safe from initial deployment. It also claims models usable on day one without customer data.

Technology

The SMILE platform combines multimodal inference, predictive intelligence and a Virtual Fab digital twin. Virtual Fab generates synthetic sensor, equipment and wafer data spanning manufacturing stages, used to pre-train models so they work without customer data and to cross-validate against real fab data. Agentic AI components learn from this data in real time, automatically classify defect patterns, and study historical engineer recipe adjustments and optimization strategies to produce step-specific recommendations. Wafer position and defect information is compressed into vectors for similar-case retrieval, and human-in-the-loop agents carry recommendations through to action. The company holds patents on EPE budget component analysis and agent-based RCA in manufacturing (US and KR).

Go-to-market

The company markets directly to fabs through PoC engagements, inviting prospects to discuss deployment scenarios even without prepared data. It builds visibility through technical publications at SPIE Advanced Lithography, industry events including SEMICON Taiwan 2026 and deep tech convergence forums, investor competitions such as the Lam Capital Venture Competition, and partner collaborations such as its MOU with Auros Technology.

Semiconductor manufacturers and fabs, including engineers responsible for yield analysis, process control and root-cause analysis at advanced nodes.

Geography

Headquarters and R&D are in Seoul, South Korea (2F, Financial News Building, 315 Gangnam-daero, Seocho-gu). The company also operates a Silicon Valley office at 100 Middlefield Road, Menlo Park, California, and has presented at SEMICON Taiwan 2026.

History

SemiAI was founded in January 2025. In April 2025 it validated its core models, and in June 2025 signed an MOU and joint PoC with Auros Technology. Government R&D support followed in July 2025, and in August 2025 the company closed a seed round led by ENSL Partners. In September 2025 it was selected for the TIPS Deep Tech Track and established a corporate R&D center; in October 2025 Kakao Ventures joined the seed round and the company obtained venture business certification. SMILE Lite v1.0 and Pro v0.5 shipped in December 2025. In February 2026 it gave three technical presentations at SPIE Advanced Lithography 2026, closed a Seed II round with Newborn Ventures and signed its first paid PoC in March 2026, was named a Lam Capital Venture Competition Finalist 10 in May 2026, and raised a bridge round from Schmidt in July 2026 to fund US PoC expansion and local hiring.

Compiled by commissioned research from 6 cited public sources β€” announcements, filings, and press listed under research sources below.

Key figures

latest reported
HeadcountAug 202613
Model R-squaredJan 2026> 0.9
MVP root cause analysis accuracyApr 202595%
Overlay defect prediction accuracy (core model validation)Apr 202599%
Overlay prediction accuracyJan 20260.3 nm
RMSE improvement vs XGBoostJan 20263x
Yield analysis and improvement cycle timeNov 2025Reduced from over seven days to under ten minutes (company-stated)

Company-reported or press-reported figures, each dated to when it was claimed β€” not independently audited.

Timeline Β· 12

launches, deals, and filings
Jul 2026
Bridge round raised from Schmidt

Raised a bridge round from Schmidt to fund US proof-of-concept expansion and local hiring.

source β†—

May 2026
Lam Capital Venture Competition Finalist 10

Named a Finalist 10 at the Lam Capital Venture Competition.

source β†—

Mar 2026
Seed II round closed with Newborn Ventures

Closed the Seed II round with Newborn Ventures and began preparing for US expansion.

source β†—

Mar 2026
First paid PoC contract signed

Signed a first paid proof-of-concept contract with a semiconductor customer, with two additional PoCs running in parallel.

source β†—

Feb 2026
Three technical presentations at SPIE Advanced Lithography 2026

Presented on overlay prediction, human-in-the-loop root cause analysis, and domain-fusion machine learning.

source β†—

Jan 2026
US expansion with Silicon Valley office

Opened a Silicon Valley office in Menlo Park, California, alongside the Seoul headquarters and R&D site, in support of US PoCs and local hiring.

source β†—

Jan 2026
Presentation at SEMICON Taiwan 2026

SemiAI presented its agentic AI technology for semiconductor manufacturing at SEMICON Taiwan 2026.

source β†—

Dec 2025
SMILE Lite v1.0 and SMILE Pro v0.5 released

First public versions of the SMILE platform shipped, with operation beginning in customer environments.

source β†—

Oct 2025
Kakao Ventures seed extension

Kakao Ventures joined the seed round; the company also obtained venture business certification.

source β†—

Sep 2025
Selected for TIPS Deep Tech Track

Accepted into the TIPS Deep Tech Track; the company also established a corporate R&D center.

source β†—

Aug 2025
Seed round closed, led by ENSL Partners

SemiAI closed its first seed round led by ENSL Partners.

source β†—

Jun 2025
MOU with Auros Technology and joint PoC

SemiAI signed an MOU with Auros Technology, its first partner collaboration, and launched a joint proof-of-concept.

source β†—

Dated company events from announcements, filings, and press; legal rows summarize public dockets and regulator releases.

β–ΈResearch sources Β· 6

primary sources listed

6 public sources were cited for this profile; the first-party ones are listed here.

Frequently asked questions

What does SemiAI do?
SemiAI develops SMILE, an agentic AI platform that predicts yield and process issues for semiconductor fabs.
Who are SemiAI's investors?
SemiAI's investors include Kakao Ventures.