Dream Photonics Inc

Market position

Positioned as a supplier of silicon photonics PDKs, IP and photonic wire bonding packaging services to the semiconductor and photonics ecosystem, with support from Canadian public research programs such as NRC IRAP, NSERC and CMC Microsystems' FABrIC program.

The company states it has access to the first tool in the world able to offer photonic wire bonding as a service, enabling fiber-to-chip, chip-to-chip and on-chip laser and fiber integration, and that it enabled the first open-access MPW tape-out with hybrid integrated lasers.

Technology

Core technologies include photonic wire bonding for laser and fiber integration, photonic wire bonding lenses, silicon-verified photonic devices and IP cores, and process design kits with layout views, documentation and experimentally calibrated circuit simulation models for O-band and C-band components in TE and TM polarizations, delivered for multiple EDA toolsets. A 2025 project targets wafer-scale advanced packaging of silicon PICs using 3D-printed optical components, and another addresses integration of quantum light sources into semiconductor platforms.

Go-to-market

Silicon photonics foundries requiring qualified component libraries and PDKs, and companies designing photonic integrated circuits that need hybrid laser and fiber packaging or device and system IP.

Geography

Offices in Vancouver, British Columbia, Canada and Woodinville, Washington, USA, with foundry PDK engagements described as global and connections to UK researchers, companies and policymakers.

History

The company's published timeline begins in 2020 with a first tapeout to build the Dream Photonics Process Design Kit for AIM Photonics. In 2021 it engaged customers and partners on hybrid integration using photonic wirebonds and enabled a fiber attach solution for the AMF silicon photonics platform, which became a public offering. In 2022 it officially launched the Dream Photonics AIM PDK and enabled the first open-access multi-project wafer tape-out with hybrid integrated lasers in collaboration with Applied Nanotools and CMC Microsystems. In 2023 it expanded its portfolio of PIC hybrid integration solutions through photonic wirebonding, broadened its IP core offering and PDK maturity with additional foundry partners and customers, and received support from the National Research Council Industrial Research Assistance Program as one of 11 Canadian firms funded under a joint Canada–UK R&D call by the NRC and UK Research and Innovation. In 2024 the company signed its 20th customer and was associated with HATCH Venture Builder, UBC's late-stage accelerator. In 2025 it reported over $1 million in funding from NSERC and NRC for a project on embedding quantum light sources into semiconductor-based platforms, received CMC FABrIC support for wafer-scale optical packaging using 3D-printed optical components, and signed its 35th customer.