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Capcon

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Capcon (Huafeng Technology) is a Beijing-based maker of advanced semiconductor packaging equipment, including die/flip-chip bonders for FOWLP, POP, SiP and 2.5D/3D packaging, serving customers like TSMC and ASE.

Investors · 1

Frequently asked questions

What does Capcon do?
Capcon (Huafeng Technology) is a Beijing-based maker of advanced semiconductor packaging equipment, including die/flip-chip bonders for FOWLP, POP, SiP and 2.5D/3D packaging, serving customers like TSMC and ASE.
Who are Capcon's investors?
Capcon's investors include Intel Capital.