Bos Semi

BOS Semiconductors (BOS, short for "Best Of Silicon") is a fabless semiconductor company headquartered in Seongnam-si, Gyeonggi-do, South Korea, that designs chips for automotive, advanced mobility and robotics computing. Its product line is the Eagle chiplet system-on-chip family, aimed at advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI).

The first Eagle product, Eagle-N, is an automotive AI accelerator rated at 250 INT8 TOPS (dense) that connects to host application processors over PCIe Gen5 or, in chiplet configurations, UCIe. It implements Tensix NPU cores licensed from Tenstorrent, together with Arm Cortex-A53 CPUs, LPDDR5X memory, USB 2.0, a security engine, ASIL-B and AEC-Q100 Grade 2 targets, programmable RISC-V cores, structured sparsity support, and four-way physical partitioning for virtualization; the company cites 2x TOPS/$ and 1.5x TOPS/W versus existing solutions and targets mass production in 2027. Eagle-A is a planned standalone one-chip ADAS SoC at 150 TOPS (dense) combining CPU, GPU, NPU, ISP, DSP and camera, LiDAR and radar sensing interfaces, with UCIe and PCIe for compatibility with Eagle-N and third-party accelerators, targeted for mass production in 2028. BOS also lists automotive and physical-AI co-processor devices N1501 (250 INT8 TOPS dense) and N1301 (190 INT8 TOPS dense) built around a dedicated processing engine, Arm Cortex-A53, PCIe, USB, SD/eMMC, OSPI, low-speed IO and LPDDR5X. Multi-chip Eagle combinations are marketed at up to 800 TOPS (two Eagle-N plus two Eagle-A) for ADAS, IVI, LLM and VLM workloads.

Alongside silicon, BOS offers a developer software stack including an AI Model SDK covering model preparation, compilation and deployment across host systems and the Eagle-N accelerator, supporting conversational agents, perception models and autonomous systems.

Business model

Fabless semiconductor supplier: BOS designs automotive and robotics SoCs and AI accelerator chiplets, licensing third-party IP such as Tenstorrent NPU cores and Arm CPUs, and supports customers with an AI Model SDK and developer tooling. Products are positioned for volume automotive programs, with Eagle-N mass production targeted for 2027 and Eagle-A for 2028.

Traction

The company reports 220+ engineers and a leadership team with prior experience at Apple, Tesla, Samsung and Baidu. It has obtained ISO 26262 functional safety management certification, secured a Series A round reported at roughly $60.2-67 million in February 2026, and is preparing Eagle-N for mass production in 2027 while expanding its global sales network.

Latest developments

In February 2026 BOS announced a Series A round of roughly $60.2-67 million to fund mass production, global sales expansion and further mobility AI chip development. The company unveiled Eagle-N with Tenstorrent, obtained ISO 26262 functional safety management certification, planned an AI Box demonstration at CES 2026, and presented the chiplet-based Eagle-N accelerator at Hot Chips 2026.