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Alsemy Inc

Founded 2019 · 15 employees on LinkedIn · 3 known investors

Alsemy builds AI-driven platforms that generate neural network-based device compact models and optimize semiconductor design and manufacturing through process modeling, simulation, and DTCO. Its products (Alsis, Alsphere, Alscope) serve the semiconductor industry to accelerate chip modeling and reduce process bottlenecks.

Investors · 3

Company profile

researched Aug 2026

Alsemy Inc is a Korea-based company applying artificial intelligence to semiconductor modeling, simulation and manufacturing optimization. It markets three products: Alsis, which generates neural network-based device compact models intended to support accurate circuit simulation; Alsphere, a platform for optimizing semiconductor manufacturing through process modeling simulation and reverse engineering; and Alscope, a platform for semiconductor design and manufacturing optimization aimed at collaboration across the industry ecosystem and at accelerating design-technology co-optimization (DTCO) simulation.

Alongside its commercial products, the company participates in academic research on advanced transistor architectures. Alsemy researchers co-authored a 2024 paper with Hanyang University evaluating the impact of strain on sub-3 nm gate-all-around CMOS logic circuit performance using a neural compact modeling approach trained on 3D simulation data, and a 2025 paper with Sungkyunkwan University exploring optimal transition metal dichalcogenide (TMDC, specifically MoS2) multi-nanosheet GAA-FET architectures for the 0.7 nm technology node.

Latest developments

Company news listings reference coverage published by NVIDIA in June 2026 on accelerating chip modeling with physics-informed AI, and Korean outlet Maeil Business Newspaper items in June and July 2026 on reducing semiconductor process bottlenecks and on the company's participation in an invitation-only dinner hosted by NVIDIA's Jensen Huang.

Full profile — market position, technology, go-to-market, geography

Market position

Alsemy positions its tools within the semiconductor modeling and simulation segment, addressing device compact modeling, process optimization and DTCO. Its research output with Korean universities has been indexed by trade publication Semiconductor Engineering, and NVIDIA published material on the company's use of physics-informed AI for chip modeling.

Technology

The company's core approach is the use of neural networks and physics-informed AI to replace or accelerate conventional semiconductor modeling workflows. Alsis produces neural network-based device compact models for circuit simulation; Alsphere applies AI to process modeling simulation and reverse engineering of manufacturing processes; and Alscope targets AI-accelerated DTCO simulation. Published work with university collaborators applies neural compact modeling to sub-3 nm gate-all-around CMOS devices and to TMDC-channel multi-nanosheet FET architectures at sub-1 nm nodes.

Go-to-market

Semiconductor device makers, foundries and chip design organizations that perform device compact modeling, process simulation and design-technology co-optimization.

Geography

Headquartered in South Korea, with research collaborations involving Korean universities including Hanyang University and Sungkyunkwan University.

Compiled by commissioned research from 5 cited public sources — announcements, filings, and press listed under research sources below.

Timeline · 3

launches, deals, and filings
Jun 2026
NVIDIA publishes item on Alsemy accelerating chip modeling with physics-informed AI

Alsemy's news listing cites an NVIDIA item titled "Alsemy Accelerates Chip Modeling From Months to Minutes With Physics-Informed AI."

source ↗

Jun 2025
Technical paper on TMDC multi-nanosheet GAA-FET architectures published with Sungkyunkwan University

A paper titled "Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes" was published by researchers at Sungkyunkwan University and Alsemy Inc, covering design and optimization of MoS2-channel multi-nanosheet FETs for the 0.7 nm node.

source ↗

Sep 2024
Technical paper on neural compact modeling of strained sub-3 nm GAA CMOS published with Hanyang University

A paper titled "Impact of Strain on Sub-3 nm Gate-all-Around CMOS Logic Circuit Performance Using a Neural Compact Modeling Approach" was published by researchers at Hanyang University and Alsemy Inc, using a neural compact model trained on 3D simulation data.

source ↗

Dated company events from announcements, filings, and press; legal rows summarize public dockets and regulator releases.

Research sources · 5

primary sources listed

5 public sources were cited for this profile; the first-party ones are listed here.

Frequently asked questions

What does Alsemy Inc do?
Korean company building AI-driven platforms for semiconductor device compact modeling, process simulation and DTCO.
Who are Alsemy Inc's investors?
Alsemy Inc's investors include Ascendo Ventures, Laguna Investment, LG Technology Ventures.